IEEE ICCSC 2008 General Chair:
Professor Rueywen Liu, Univ. of Notre Dame
liu.1@nd.edu
IEEE ICCSC 2008 Co-General Chairs:
Professor Jianping Chen, Shanghai Jiao Tong University
Jpchen62@sjtu.edu.cn
Professor Guo-Zhi Xu, Shanghai Jiao Tong University
gzxu@sjtu.edu.cn
IEEE ICCSC 2008 Technical Program Chair:
Dr. Stephen Weinstein, Communication Theory & TechnologyConsulting
s.weinstein@ieee.org
IEEE ICCSC 2008 Technical Program Co-chair:
Professor Wen Chen, Shanghai Jiao Tong University
wenchen@sjtu.edu.cn
IEEE ICCSC 2008 Organization Chair
Professor Zhengming Xue, Shanghai Jiao Tong University
zgxue@sjtu.edu.cn
IEEE ICCSC 2008 Publication Chair
Professor Bo Hu, Fudan University of Shanghai
bohu@fudan.edu.cn
Technical Program Committee Chair:
Weinstein, Stephen – Commun. Theory & Technology Consulting LLC,
New Jersey, USA
Technical Program Committee Co-Chair:
Chen, Wen – Shanghai Jiao Tong University, China
Technical Program Committee Members:
Addeo, Eric – Devry University, USA
Akan, Ozgur – Middle East Technical University, Turkey
Akyildiz, Ian – Georgia Tech, Atlanta, USA
Badawy, Wael – University of Calgary, Canada
Bayoumi, Magdy – University of Louisiana at Lafayette , USA
Cheng, Julian – University of British Columbia-Okanagan, Canada
Choma, John – University of Southern California, USA
Chowdhury, Masud – University of Illinois at Chicago, USA
Cimini, Len – University of Delaware, USA
Ding, Zhi – UC Davis, USA
Dong, Xiaodai – University of Victoria, B.C., Canada
Ekici, Eylem – Ohio State University, USA
Fang, Yuguang (Michael) – University of Florida, USA
Gao, Xiqi – Nat'l Mobile Commun. Res. Laboratory, SE University, China
Galli, Stefano – Panasonic Research, USA.
Ge, Ning – Tsinghua University, China
Greenstein, Larry – Rutgers University WINLab, USA.
He, Di – Shanghai Jiaotong University, USA
Hu, Bo – Fudan University, China
Jabbari, Bijan – George Mason University, USA
Jiang, Danchi – University of Tasmania, Australia
Kuehnel, Thomas – Microsoft Corporation, USA
Kuo, Geng-Sheng – National Chengchi University, Taiwan
Lee, Chang-Ho – Samsung RFIC Design Center, Georgia Tech, USA
Lin, Kenneth – Tongji University, China
Ling, Nam – Santa Clara University, USA
Li, Jun - Shanghai Jiao Tong University, China
Liu, Jiangchuan – Simon Fraser University, Canada
Liu, Rueywen – University of Notre Dame, USA (Conf. General Chair)
Luo, Hui – Broadcom, USA
Mathur, Saurabh – Thomson, Inc, USA
Melodia, Tommaso – SUNY Buffalo, USA
Ogunfunmi, Tokunbo – Santa Clara University, USA
Park, Seong Yong – Samsung, Korea
Pompili,Dario – Rutgers University, USA
Qiu, Hongbing Guilin – University of Electronic Technology, China
Redlich, Jens – Humboldt University, Berlin, Germany
Rui, Xianyi – Shanghai Jiaotong University, China
Ruan, Yingzi - Xidian University, China
Shanmugan, Sam - University of Kansas, USA
She, Feng – Shanghai Jiaotong University, China
Sobelman, Gerald – University of Minnesota, USA
Taniguchi, Tomohiko – Fujitsu Laboratories Limited, Japan
Tao, Meixia – National University of Singapore
Tellambura, Chintha – University of Alberta, Canada
Vuran, Mehmet –University of Nebraska-Lincoln
Wang, Qiao – Southeast University, China
Wang, Ting – NEC Labs America, USA
Wang, Xiaodong – Columbia University, USA
Wang, Xiaofan – Shanghai Jiao Tong University, China
Wang, Xinbing – Shanghai Jiao Tong University, China
Wilson, Sarah Kate – Santa Clara University, USA
Xia, Xiang-gen – University of Delaware, USA
Xiao, Yang – University of Alabama, USA
Xu, Zhengyuan – University of California at Riverside, USA
Yang, Xiaokang – Shanghai Jiao Tong University, China
Ying, Rendong – Shanghai Jiaotong University, China
Zhang, Qinyu – Harbin Institute of Technology, Shenzhen, China
Zitterbart, Martina – University of Karlsruhe, Germany |
